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What do you recommend for component storage to prohibit oxidation including relative humidity, nitrogen atmosphere, temperature? Board Talk
Is there a mathematical calculation that can be used to predict solder balling for a given package size? Board Talk
Which storage method will better protect against corrosion, nitrogen or super dry? You want to do it in compliance with IPC 1602, which covers storage and handling of circuit boards. Board Talk
What are the risks using flux only versus solder paste for placing BGAs in a hybrid lead-free environment? Why would you only use flux, why not solder paste? Board Talk
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Board Talk
After selective soldering connectors there is a small amount of no-clean flux residue left behind. How can I judge how much flux residue can be left behind? Board Talk
Are there any special requirements for depaneling and rescoring separate panel circuit boards if they contain BGA components? Board Talk
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Board Talk
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this scenario. Board Talk
What is the desirable intermetallic layer thickness? I have read that 1 - 2.5 micron thickness of tin-copper and a .4 - .8 micron thickness on tin-nickel. Board Talk |
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